Harikrishnan Venugopal
Available for full-time roles · Germany

Harikrishnan Venugopal

Ph.D. Candidate in Nanotechnology & Materials Science · Paderborn University

BCP Lithography Sub-10 nm Patterning (~8 nm) Cleanroom · 7 yrs SEM · TEM · AFM · XPS R&D Engineer
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Physicist building tomorrow's nanodevices

I am a materials scientist and physicist finishing my Ph.D. at Paderborn University's NNP group, specializing in Block Copolymer (BCP) Lithography — one of the most promising next-generation patterning techniques for semiconductor and nanoelectronic device fabrication.

My work sits at the intersection of fundamental surface physics and scalable process engineering. I design and execute end-to-end nanofabrication workflows achieving sub-10 nm feature sizes (~8 nm) — from BCP lithography through thin-film deposition and multi-technique surface characterization, all inside ISO-class cleanroom environments.

With backgrounds in both India and Germany, I bring a combination of deep technical expertise, cross-cultural adaptability, and a genuine passion for translating cutting-edge research into industrial impact.

Harikrishnan Venugopal

PhD Candidate · Paderborn University

7+
Years cleanroom experience
~8 nm
Smallest feature size achieved
PhD
Expected 2026, Paderborn Univ.
3
Degrees across 2 countries
Leadership & Community
Founder & President — Materials Science Fachschaft
Paderborn University · 2018–2019 · Founded the student body from scratch
President — Indische Studierendengesellschaft
Paderborn University · 2023–2025 · Led Indian student community over two years
Block Copolymer Lithography

Advanced nanopatterning techniques enabling sub-10 nm feature sizes (down to ~8 nm) over wafer-scale surfaces — directly competitive with EUV lithography at a fraction of the cost.

What is Block Copolymer Lithography?

BCP lithography exploits the spontaneous self-assembly of polymer chain blocks into highly regular, periodic nanostructures (lines, dots, holes) with feature sizes below 10 nm — far beyond the resolution limits of conventional UV photolithography. Applied over large areas, it creates templates for device fabrication without the enormous capital cost of EUV equipment.

Full Process Workflow

1
Substrate Prep
Cleaning & surface functionalization
2
BCP Coating
Spin-coat polymer blend
3
Self-Assembly
Thermal / solvent annealing
4
RIE Etch
Selective block removal
5
Pattern Transfer
E-beam evaporation / substrate etch
Industry Collaboration · 4 Years
Confidential Semiconductor Industry Project
Worked under NDA on an applied nanopatterning project in direct collaboration with a semiconductor company over four years of my PhD. Translated academic BCP lithography research into specifications relevant to industrial device fabrication — bridging fundamental science and production-ready process engineering.
Microscopy

SEM & TEM Imaging

High-resolution imaging of nanopattern morphology, defect analysis, and cross-section characterization of thin-film stacks.

Topography

AFM Metrology

Nanoscale surface topography, roughness measurement, and mechanical property mapping of patterned substrates.

Deposition

RIE & E-Beam Evaporation

Selective etching of polymer templates and physical vapour deposition of metals and oxides for pattern transfer into hard mask or substrate.

Optical

Ellipsometry

Non-destructive, precise thickness measurement of polymer brush layers, BCPs, and thin oxide films across large areas.

Spectroscopy

IR Spectroscopy (FTIR, DRIFTS & PMIRRAS)

Infrared analysis of molecular bonding, surface chemistry, and thin-film composition — essential for polymer brush characterisation and BCP surface functionalisation.

Spectroscopy

Raman Spectroscopy

Non-destructive characterisation of material composition, crystal structure, and defect analysis of nanostructured surfaces and thin films.

Surface Analysis

Surface Wettability Analysis

Drop shape analysis (DSA) and fibre tensiometry for quantitative surface energy measurements — critical for substrate preparation prior to BCP self-assembly.

Surface Analysis

XPS

X-ray photoelectron spectroscopy for elemental composition and chemical-state analysis of polymer films, functionalized surfaces, and thin-film interfaces.

2D Materials

Graphene Transfer & Nanopatterning

Transfer of graphene to planar and patterned substrates; BCP lithography for sub-10 nm nanopatterning on graphene — enabling next-generation 2D material device fabrication.

Skills & Expertise

Lithography & Fabrication

BCP Self-Assembly & DSAExpert
Reactive Ion Etching (RIE)Expert
E-Beam Evaporation / PVDAdvanced
Electron Beam LithographyAdvanced
Nanosphere LithographyProficient

Characterization

SEMExpert
AFMExpert
Surface Wettability Analysis (DSA & Tensiometry)Expert
TEMAdvanced
IR Spectroscopy (FTIR, DRIFTS & PMIRRAS)Advanced
XPSAdvanced
EllipsometryAdvanced
Raman SpectroscopyAdvanced

Software & Computing

MATLABBasic
ImageJ / OriginProAdvanced

Languages

EnglishProfessional
GermanB1 – improving
Experience & Education

Ph.D. Candidate – Nanopatterning & Nanotechnology

2021 – Present Paderborn University, NNP Group
  • Thesis: Formation and Control of Nanostructures in High-χ PS-b-PDMS Block Copolymers for Next Generation Lithography
  • Developing scalable Block Copolymer lithography achieving sub-10 nm feature sizes (~8 nm) over large areas
  • Full cleanroom process ownership: substrate prep → BCP self-assembly → RIE → evaporation
  • Characterization via SEM, TEM, AFM, XPS, Ellipsometry, PMIRRAS for process validation
  • Graphene transfer to planar and patterned substrates; BCP lithography for nanopatterning on graphene — a key area for next-generation 2D material device fabrication

Research Assistant – NNP Group

Oct 2018 – May 2021 Paderborn University
  • RIE and e-beam evaporation process development for BCP lithography R&D
  • Operated and maintained SEM, AFM, XPS, and ellipsometer systems
  • Trained new lab members on cleanroom protocols; contributed to SOP documentation

M.Sc. Materials Science

2017 – 2020 Paderborn University, Germany
  • Thesis: Investigation of PMMA Removal Strategies in Nanophase-Separated PS-PMMA Thin Films using XPS and Optical Techniques

Associate Engineer – Trade Compliance

Sep 2015 – Aug 2017 BURNDY / Hubbell Inc., Cochin, India
  • HTS product classification, U.S. export licensing (ECCN), and NAFTA/FTA compliance

B.Tech. Mechanical Engineering

2011 – 2015 MG University, Kerala, India
  • Best Outgoing Student award | Best Speaker | Player of the Tournament
Industry Relevance

My nanofabrication expertise directly enables technological challenges in these German industry sectors.

🔬

Semiconductors & Electronics

BCP lithography for sub-10 nm patterning, next-gen memory and logic devices, MEMS sensor fabrication.

Infineon Bosch Semi ASML Siltronic ams OSRAM

Energy & Renewables

Nanostructured electrodes for batteries & supercapacitors, photonic structures for solar cells, fuel cell membranes.

BASF Evonik Fraunhofer ISE SMA Solar
🚗

Automotive & Mobility

Advanced sensor fabrication (MEMS, nanoelectrode arrays), EV battery electrode nanostructuring, high-performance coatings.

Bosch Continental Schaeffler ZF
🧪

Chemicals & Pharma

Nanoporous BCP membranes for filtration, drug delivery scaffolds, surface-functionalized biosensors.

Merck KGaA Bayer Evonik Sartorius
✈️

Aerospace & Defense

IR sensors, photonic components, high-performance coatings, and MEMS-based inertial sensors for precision applications.

Airbus DLR Hensoldt MTU Aero
🏛️

Research & National Labs

Deep R&D, advanced nanofabrication facility support, interdisciplinary research programs in physics and materials science.

Fraunhofer Max Planck Forschungszentrum Jülich
Let's connect

I am actively looking for R&D, process engineering, or materials scientist positions in Germany, expected to start mid-to-late 2026.